AGS
Plasma Systems, Inc. 
System 1700 - PECVD
Batch
Deposition
A versatile
multi-process PECVD tool with flexible controls and excellent uniformity - all
for low price.
S17-PECVD
Features
If you need reliability time after
time when depositing low temperature films, the System 1700-Plasma Enhanced
Chemical Vapor Deposition tool offers you the best value. Excellent process
control and trouble-free operation can be yours.
- High performance PECVD at a low cost
- SiO2, SiNx, Amorphous Si, Oxynitride and carbon films
- Low temperature passivation and ILD films for III-V and HTSC compunds
- Configure as PECVD or ECR deposition tool
- Safety interlocks meet stringent requirements
- Low hydrogen containing films assured by using residual stripping cryo pump
- NEW! mixed frequency and pulsed RF options for stress control
- Closed loop (PID) control of deposition temperature
- Unique "Direct-Connect" construction is easy to service or upgrade
S17-PECVD Delivery
Delivery: 90 days ARO
Warranty: 1 year parts & labor
Installation: Start up & training are included with the system
Service: 1 year of quarterly PM's can be included with each system
Extraordinary capability -
Excellent value
"A whole new plasma system"
For more information:
Please send your questions, comments, or suggestions to the AGS Sales desk
Copyright 1991-2008 AGS Plasma - All Rights Reserved
MPS, System 1700, APC-2000, & PlasmOps are trademarks of AGS Plasma.
Other trademarks are the property of their respective owners.
Prices and specifications subject to change without notice.
Last update made on: 6 September, 2008 by Webmaster