AGS
Plasma Systems, Inc. 
MPS - HDP
High
Density Plasma
HDP
Source
Using our standard MPS platform, this Inductively Coupled Plasma (ICP) tool can be helpful where high etch rates and low damage are required. AGS utilizes a compact, self contained, economical HDP plasma source.
MPS-HDP Features
High-density tools offer the ability to produce a very
reactive plasma with less radiation exposure to your substrate. Higher etch (or
deposition) rates and lower processing temperatures are just two of the
benefits of HDP's. Our HDP system utilizes our basic
RIE (or PECVD) platform and utilizes a patented, highly reliable, magnetically
coupled plasma (MCP) source to produce high yield ion flux. MCP sources offer
greater reliability over ECR sources due to our unique multi-coil design and by
using lower frequencies. Normally used for etching, it is also available in a
deposition version and either are field retrofitable.
- SiO2, SiNx, TiW, GaAs, resist, ILD and polyimide, micromachining (MEMS), photonics, HTSC's, and for failure analysis
- Accepts any size substrate from 1" to 12" wafers, flat panels, or custom packages
- Target focusing electromagnets fine tune process uniformity
- Easy to use and simple to service
- Safe, rugged design means high reliability with remarkable uptime
- Simple 6 piece chamber construction is versatile and easy to upgrade
MPS-HDP Delivery
Delivery: 90 days ARO
Warranty: 1 year parts & labor
Installation: Start up & training are included with the system
Service: 1 year of quarterly PM's can be included with each system
Extraordinary capability -
Excellent value
"A whole new plasma system"
For more information:
Please send your questions, comments, or suggestions to the AGS Sales desk
Copyright 1991-2008 AGS Plasma - All Rights Reserved
System 1700, APC-1000, & PlasmOps are trademarks of AGS Plasma.
Other trademarks are the property of their respective owners.
Prices and specifications subject to change without notice.
Last update made on: 6 September, 2008 by Webmaster